Wednesday, February 9, 2011

Scythe Universal Retention Kit 3: secure mounting for last-generation CPUs

Scythe has announced the launch of the third version of its universal retention kit for heatsinks. This upgraded version comes with several enhancements and Multisocket broad support for both AMD and Intel. The list of compatible sockets containing Intel Socket T LGA775, LGA1156, 1366 and the new socket LGA1155.

As for AMD, is compatible with sockets 754, 939, AM2, AM2 +, AM3 and 940. The Universal Retention Kit 3 is, again, based on a mounting backplate that allows contact pressure and securely mount sinks even larger and heavier the market. The retention brackets are usually provided with motherboards AMD are plastic, and are likely to break if you install a high performance cooler.

This is no problem with the Universal Retention Kit 3 of Scythe, as it is made of steel, and therefore provides the stiffness needed to withstand the heavier sinks and large market. As for Intel, the Universal Retention Kit 3 to change the conventional anchoring method using pushpins to a more secure anchorage with backplate, providing high mechanical stability.

In order to remove the anchoring system based on pushpins, Scythe provides a specific tool to remove them without problems. Specifications: Model: Universal Retention Kit 3 (SCURK-3000) Supported Sockets: Intel Socket T / LGA775, LGA1155, LGA1156, 1366. AMD Socket 754, 939, AM2, AM2 +, AM3, 940.

Accessories: universal backplate (metal) retention bracket (metal), wrench, screws, push-pin removal tool, manual (multilejguaje), nuts. Dimensions: 92 x 145x 36 mm Weight: 185 g.

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