An official indicated that TSMC's 28 nm knew that a very promising start. He also responded to the announcement of Intel for the manufacture of bulk FinFET saying it would not produce 3D transistors in 20 nm. According to the roadmap of the founder, chips etched into 20 nm should be marketed in the second half of 2012.
Meanwhile he is preparing to move to 28 nm and welcomes the many designs submitted. It is three times higher than it was when TSMC will launch its 40 nm. Specifically, TSMC would currently 89 tapeout. Tapeout is the name of the last stage of the development of an integrated circuit. The manufacturer sends the design to the smelter and the masks that will be adjusted to optimize the chip manufacturing.
TSMC would have received 89 designs to manufacture. He believes he owns at the moment 90% of 28-nm designs. This enthusiasm for this new manufacturing process would be mainly driven by the market of mobile devices. Manufacturers want to have smaller processors and consume less energy. They are also more efficient models for the same size.
Extremely fierce competition drives them to invest in these new subtleties of printmaking. TSMC has taken this announces positive cons balance the fact that it would not make transistors in 3D any time soon. To recap, Intel announced last week its FinFET (cf. "Tri-Gate: Intel invented the transistor 3D).
Instead of using a planar structure, he built the source and the drain on the grid. Very schematically, it helps to better distribute the number of electrons flowing through the transistor and reduce leakage current. As we noted in our news, TSMC has already shown FinFET transistors, but he admitted today that he is still far from being able to mass produce.
Let us take a look at the history of semiconductors and a sample relatively close, that is to say that the high-k metal gate (HKMG). Intel has sold its first transistors using a metal grille and high-k insulating layer in November 2007 with the introduction of its 45nm processors. The rest of the industry has finally followed when the founders moved to 32 nm.
The first chips from AMD are expected to arrive this year. It has taken more than two years for the industry to catch up with Intel. Intel will sell its first processors with 3D transistors early 2012, during the induction of Ivy Bridge and its 22 nm. If history repeats itself, the foundry will manufacture FinFET when they move to 16/14 nm, which should not happen before 2015. 
Meanwhile he is preparing to move to 28 nm and welcomes the many designs submitted. It is three times higher than it was when TSMC will launch its 40 nm. Specifically, TSMC would currently 89 tapeout. Tapeout is the name of the last stage of the development of an integrated circuit. The manufacturer sends the design to the smelter and the masks that will be adjusted to optimize the chip manufacturing.
TSMC would have received 89 designs to manufacture. He believes he owns at the moment 90% of 28-nm designs. This enthusiasm for this new manufacturing process would be mainly driven by the market of mobile devices. Manufacturers want to have smaller processors and consume less energy. They are also more efficient models for the same size.
Extremely fierce competition drives them to invest in these new subtleties of printmaking. TSMC has taken this announces positive cons balance the fact that it would not make transistors in 3D any time soon. To recap, Intel announced last week its FinFET (cf. "Tri-Gate: Intel invented the transistor 3D).
Instead of using a planar structure, he built the source and the drain on the grid. Very schematically, it helps to better distribute the number of electrons flowing through the transistor and reduce leakage current. As we noted in our news, TSMC has already shown FinFET transistors, but he admitted today that he is still far from being able to mass produce.
Let us take a look at the history of semiconductors and a sample relatively close, that is to say that the high-k metal gate (HKMG). Intel has sold its first transistors using a metal grille and high-k insulating layer in November 2007 with the introduction of its 45nm processors. The rest of the industry has finally followed when the founders moved to 32 nm.
The first chips from AMD are expected to arrive this year. It has taken more than two years for the industry to catch up with Intel. Intel will sell its first processors with 3D transistors early 2012, during the induction of Ivy Bridge and its 22 nm. If history repeats itself, the foundry will manufacture FinFET when they move to 16/14 nm, which should not happen before 2015.
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