Toshiba has just demonstrated the first modules of NAND 128 GB etched into 19 nm. These are the smallest cell NAND now, and if all goes well, mass production should start during the summer. These modules have 2 MLC bits per cell and account for 8 GB in a die of 118 mm2. Toshiba is then able to combine 16 dies in one package for a chip with 128 GB capacity is two times higher than the previous record.
Deliveries of the first test samples have already started, which is a good sign. It will probably still wait a year before seeing a tablet or smartphone use this chip and a year or two before this technology is integrated by default in mid-range terminals. The next step is to create a Toshiba MLC comprising 3 bits per cell and using the same fine engraving. 
Deliveries of the first test samples have already started, which is a good sign. It will probably still wait a year before seeing a tablet or smartphone use this chip and a year or two before this technology is integrated by default in mid-range terminals. The next step is to create a Toshiba MLC comprising 3 bits per cell and using the same fine engraving.
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