Wednesday, April 20, 2011

Plain Platform USB 3.0 integrated AMD chipsets

The new chipsets A75 and A70M called "plain" that AMD plans to release within days its Fusion platform will be supported 32nm SuperSpeed USB 3.0. With this, AMD will offer this technology to a much lower cost than Intel's, not only for the price of the whole, but also for ease of integration into the system.

New Llano architecture processors use two chipsets (the A75 and A70M) either on laptops or desktops, and also will have more cores, more graphics power, and more integration options included in a new generation of netbooks and notebooks Ultralight.

No comments:

Post a Comment