Monday, March 14, 2011

Cooling of the GTX 590 GTX 295 reminiscent of revB

Emerging online images and the characteristics of the cooling system that will take on nVidia GeForce GTX 590. With a design similar to the GeForce GXT 295 rev. B (the first dual-GPU card to single PCB created by nVidia) the cooling is to use two independent heatsinks with a central fan that blows fresh air.

But this time instead of radiators with two heatpipes are the most efficient type of vapor-chamber heat sinks. Nvidia states that the top cover, which was responsible for conveying the air to the radiators, is easily removed for cleaning. The video memory chips on the front, the SLI bridge and the components of the VRM area, are surmounted by a metal plate shaped, while the rear zone are cooled by a backplate.


The schedule posted on the forum Semiaccurate on this data confirms the presence of two GPU GF110, each with 512 Cores CUDA, and 3072 MB of graphics memory GDDR5 total. Also highlights the particular PCB 12 layers with tracks that include twice as much copper (2oz) and a section of Power Supply to 10 steps supported by two 8-pin PCIe connectors.

The debut of the GeForce GTX 590 is scheduled for March 22.

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