Were moved further steps towards the standardization of memory modules hybrid solutions involving combination of different technologies to create new features that until now could only be achieved through the use of two or more separate components. The JEDEC Solid State Technology Association has created a new committee, chaired by PNY Technologies and Cypress Semiconductor, which will deal with the ratification of the new specifications, ensuring it is given space to the standard components and non-proprietary solutions.
The hybrid memory modules will cover very specific areas of use: for example, will make possible non-volatile RAM chips using a combination of DRAM and NAND flash chip that could be useful in case of blackouts, to ensure greater data security devices storage and backup.
The hybrid memory modules will cover very specific areas of use: for example, will make possible non-volatile RAM chips using a combination of DRAM and NAND flash chip that could be useful in case of blackouts, to ensure greater data security devices storage and backup.
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