The manufacturer is currently preparing new SanDisk flash memory modules and iNAND iNAND Ultra for the embedded market. Using NAND flash memory chips etched 24 nm MLC (3-bit-per-cell for the iNAND and 2-bit-per-cell for iNAND Ultra), these modules EFD (Embedded Flash Drive) 64 GB most are offered in a relatively compact packaging with dimensions of 11.5 x 13 x 1 mm.
Availability is announced for the third quarter of 2011. If the modules are primarily intended for iNAND smartphones, SanDisk also introduced modules for Tablet Touch Panel ISSD. Available in capacities ranging from 4GB to 64GB, these modules in BGA package using MLC NAND memory chips. The exact specifications of these products are unfortunately still unknown.
Availability is announced for the third quarter of 2011. If the modules are primarily intended for iNAND smartphones, SanDisk also introduced modules for Tablet Touch Panel ISSD. Available in capacities ranging from 4GB to 64GB, these modules in BGA package using MLC NAND memory chips. The exact specifications of these products are unfortunately still unknown.
- The Ratings Game: Shares of SanDisk, Micron reverse course (03/02/2011)
- SanDisk revenue forecast exceeds estimates (27/01/2011)
- SanDisk shares dive, hit margin, price fears (28/01/2011)
- This Just In: More Upgrades and Downgrades (14/01/2011)
- UPDATE 4-SanDisk revenue forecast exceeds estimates (27/01/2011)
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