Intel's presence at MWC in Barcelona is an opportunity for the giant to present many innovations without any being treated as a major. We retain the early production of Medfield Atom, a very strong mobilization around MeeGo and the first 3G LTE Modem Intel. With the virtual abandonment of MeeGo by Nokia, Intel became the main proponent of the Tablet OS for smartphone and open source.
MeeGo officially entered into Alpha stage (it was previously pre-Alpha). There is still much work before the system becomes a real competitor iOS, Android, WP7 et al. Intel is quite secretive about its mobile processors. The Moorestown platform with a flop silent (launched in spring 2010, it has been adopted by any major manufacturer), Medfield carries all the hopes for Intel to break into the market held by ARM.
Intel has confirmed that the first MWC Medfield samples were produced and delivered to their customers. Intel remains very vague about the date of finished products: one could see them "this year". Recall that Medfield should not have better performances than the current Atom. Intel has worked mainly on the compactness of its platform.
Medfield meets in a single chip in 32nm etched features over two bullets in Moorestown (Lincroft CPU and GPU which brings together, and Langwell, the chipset). Intel recently acquired Infineon, a leading provider of cellular modems. It is therefore logical that Intel today unveiled two modems, a 3G HSPA and LTE multi-mode.
The first, the XMM 6260, was announced as one of the smallest 3G HSPA modems on the market. The second XMM7060 foreshadows what will be equipped with high-end smartphones of 2012: This single chip supports both LTE (4 strips) 3G (5-band) and EDGE (4 band). 
MeeGo officially entered into Alpha stage (it was previously pre-Alpha). There is still much work before the system becomes a real competitor iOS, Android, WP7 et al. Intel is quite secretive about its mobile processors. The Moorestown platform with a flop silent (launched in spring 2010, it has been adopted by any major manufacturer), Medfield carries all the hopes for Intel to break into the market held by ARM.
Intel has confirmed that the first MWC Medfield samples were produced and delivered to their customers. Intel remains very vague about the date of finished products: one could see them "this year". Recall that Medfield should not have better performances than the current Atom. Intel has worked mainly on the compactness of its platform.
Medfield meets in a single chip in 32nm etched features over two bullets in Moorestown (Lincroft CPU and GPU which brings together, and Langwell, the chipset). Intel recently acquired Infineon, a leading provider of cellular modems. It is therefore logical that Intel today unveiled two modems, a 3G HSPA and LTE multi-mode.
The first, the XMM 6260, was announced as one of the smallest 3G HSPA modems on the market. The second XMM7060 foreshadows what will be equipped with high-end smartphones of 2012: This single chip supports both LTE (4 strips) 3G (5-band) and EDGE (4 band).
- Intel MeeGo Smartphone & Tablet at MWC; Teaser Points to a Launch (14/02/2011)
- Intel confirmed showing MeeGo phone, tablet at MWC (14/02/2011)
- Aava Mobile Medfield MeeGo/Android phone confirmed (03/02/2011)
- Intel MeeGo phone and tablet pictured at MWC (14/02/2011)
- Intel's MeeGo Smartphone Prototype Teases A New HTC Partnership? (13/02/2011)
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