Kingston will be at the Campus Party 2011

Kingston, the largest independent manufacturer of memory products in the world will participate in the Campus Party 2011 with their spatial memory for overclocking. Campus Party, citing mandatory for techies around the world, began to be held in Spain in 1997. From 11 to 17 July this year to bring together thousands of participants in the City of Arts and Sciences in Valencia.

Specifically, Kingston will provide participants of the competition "Overclocking: breaking records" his memory kits latest high performance, Kingston HyperX. The buffs compete against each other in successive rounds, leading to limit the performance of their teams. The overclock is a widespread practice among the most demanding users, which is to modify the operation of certain components to increase performance.

New world record SuperPi 32M with G. Skill DDR3 memories

During the first day of Computex 2011, the three famous overclocker Shamino, Young Pro Fredyama and broke the world record SuperPi 32M using memories G. Skill DDR3 G. Booth Skill. Achieved the incredible time of 5 minutes and 33,172 seconds in SuperPi 32M calculation, with a speed of 2340Mhz DDR3 memory with latencies CL6-9-6-25 Q1.

This is the fastest world record to date using the Intel LGA platform 1155. This amazing score was achieved thanks to the latest hardware, reports G. Skill DDR3 2400MHz CL8 (2x2GB) PI, motherboard ASUS ROG Maximus Extreme IV and an Intel Core i7 overclocked 2600K above 6GHz.

• Samsung's 30nm DDR3 DRAM boosts speeds, cuts power consumption (09/06/2011)
• Hot Tech Deals - G.Skill 4GB (1x4GB) DDR3-1333 PC3-10600 Laptop Memory $30.99 + more (08/06/2011)
• Acer Revo RL100 Media Center makes its way to the US (13/06/2011)
• Samsung puts out first 30nm DDR3 RAM upgrades for PCs (09/06/2011)
• Ready for the World / Lista Para el Mundo (11/05/2011)

Super PI (wikipedia)  G.Skill (homepage)  G.Skill (wikipedia)  DDR3 SDRAM (wikipedia)  

New 3DMark world record with Corsair Dominator GT

Corsair is pleased to announce that its Dominator DDR3 Corsair GT part of the system has again broken the world record performance in 3DMark. Vince overclockers the world famous "K | ngp | n" Lucido and Illya "TiN" Tsemenko have again broken its own record in 3DMark benchmarks, earning a score of P24347 in 3DMark 11 and 3DMark Vantage P79364.

The hardware chosen for this benchmark has been a Classified EVGA SR-2, dual Intel Xeon X5690, 4 custom EVGA GeForce graphics cards in Quad-SLI GTX580 and three modules of Corsair Dominator 2GB DDR3 GT GTX2. A total of seven pitchers used liquid nitrogen to cool Kingpin two processors, four graphics and Intel 5520 chipset.

Master Overclocking Arena 2011: Challenges in Istanbul.

The event organized by the manufacturer MSI Turkey reaches 15 and 16 April, an international event organized by MSI where 16 teams from across Europe will compete to become the European champions in 2011. The Master Overclocking Arena is considered one of the most prestigious competition which brings together the best of Europe overclokers compete to become the number one.

The objective of this contest is to increase the stock speed processors and graphics cards to reach record levels this year the event features Spanish participation in the hands of Team OC Traxtore MSI team, consisting of Draco and Vak92, who will try achieve world records MSI's hand. Performance, sound and vision: Big Bang Marshal (B3).

Exceleram announces the availability of 3 new pieces of the EP-Series

Exceleram has announced the availability of 3 new kits of RAM of the EP-Series range, expanding its product range. "The EP-Series includes memory kits based on speed of 1333 Mhz, but sinks to allow overclockers to have fun with them." Steffen said Eisensten, Product Manager Exceleram. The three new models are the same characteristics: modules of 2 Gb (1x2Gb, 2x2GB and 3 x 2 GB) with CL9 1333MHz speed.

Scythe Universal Retention Kit 3: secure mounting for last-generation CPUs

Scythe has announced the launch of the third version of its universal retention kit for heatsinks. This upgraded version comes with several enhancements and Multisocket broad support for both AMD and Intel. The list of compatible sockets containing Intel Socket T LGA775, LGA1156, 1366 and the new socket LGA1155.

As for AMD, is compatible with sockets 754, 939, AM2, AM2 +, AM3 and 940. The Universal Retention Kit 3 is, again, based on a mounting backplate that allows contact pressure and securely mount sinks even larger and heavier the market. The retention brackets are usually provided with motherboards AMD are plastic, and are likely to break if you install a high performance cooler.